On Awareness of Offset-Via and Teardrop in Advanced Packaging Interconnect Synthesis

Hao-Ju Chang, Yu-Hung Chen, Hao-Wei Huang, Yihua Yeh, Hung-Ming Chen, Chien-Nan Jimmy Liu. On Awareness of Offset-Via and Teardrop in Advanced Packaging Interconnect Synthesis. In Yuichi Nakamura 0002, Yu Wang 0002, editors, Proceedings of the 30th Asia and South Pacific Design Automation Conference, ASPDAC 2025, Tokyo, Japan, January 20-23, 2025. pages 774-780, ACM, 2025. [doi]

Abstract

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