Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition - researchr publication authors

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Cong Chen, Libing Bai, Jun Luo, Jiahao Wang, Quan Zhou, Jie Zhang 0086, Lulu Tian, Wei Huang, Yuhua Cheng 0001. Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition. In IECON 2022 - 48th Annual Conference of the IEEE Industrial Electronics Society, Brussels, Belgium, October 17-20, 2022. pages 1-6, IEEE, 2022. [doi]

This author has not been identified. Look up 'Cong Chen' in GoogleThis author has not been identified. Look up 'Libing Bai' in GoogleThis author has not been identified. Look up 'Jun Luo' in GoogleThis author has not been identified. Look up 'Jiahao Wang' in GoogleThis author has not been identified. Look up 'Quan Zhou' in GoogleThis author has not been identified. Look up 'Jie Zhang 0086' in GoogleThis author has not been identified. Look up 'Lulu Tian' in GoogleThis author has not been identified. Look up 'Wei Huang' in GoogleThis author has not been identified. Look up 'Yuhua Cheng 0001' in Google

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