Cong Chen, Libing Bai, Jun Luo, Jiahao Wang, Quan Zhou, Jie Zhang 0086, Lulu Tian, Wei Huang, Yuhua Cheng 0001. Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition. In IECON 2022 - 48th Annual Conference of the IEEE Industrial Electronics Society, Brussels, Belgium, October 17-20, 2022. pages 1-6, IEEE, 2022. [doi]
@inproceedings{ChenBLWZZTHC22,
title = {Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition},
author = {Cong Chen and Libing Bai and Jun Luo and Jiahao Wang and Quan Zhou and Jie Zhang 0086 and Lulu Tian and Wei Huang and Yuhua Cheng 0001},
year = {2022},
doi = {10.1109/IECON49645.2022.9968498},
url = {https://doi.org/10.1109/IECON49645.2022.9968498},
researchr = {https://researchr.org/publication/ChenBLWZZTHC22},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {IECON 2022 - 48th Annual Conference of the IEEE Industrial Electronics Society, Brussels, Belgium, October 17-20, 2022},
publisher = {IEEE},
isbn = {978-1-6654-8025-3},
}