Cong Chen, Libing Bai, Jun Luo, Jiahao Wang, Quan Zhou, Jie Zhang 0086, Lulu Tian, Wei Huang, Yuhua Cheng 0001. Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition. In IECON 2022 - 48th Annual Conference of the IEEE Industrial Electronics Society, Brussels, Belgium, October 17-20, 2022. pages 1-6, IEEE, 2022. [doi]
Abstract is missing.