Test cost optimization technique for the pre-bond test of 3D ICs

Yong-Xiao Chen, Yu-Jen Huang, Jin-Fu Li. Test cost optimization technique for the pre-bond test of 3D ICs. In 30th IEEE VLSI Test Symposium, VTS 2012, Maui, Hawaii, USA, 23-26 April 2012. pages 102-107, IEEE, 2012. [doi]

Authors

Yong-Xiao Chen

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Yu-Jen Huang

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Jin-Fu Li

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