Yong-Xiao Chen, Yu-Jen Huang, Jin-Fu Li. Test cost optimization technique for the pre-bond test of 3D ICs. In 30th IEEE VLSI Test Symposium, VTS 2012, Maui, Hawaii, USA, 23-26 April 2012. pages 102-107, IEEE, 2012. [doi]
@inproceedings{ChenHL12-1,
title = {Test cost optimization technique for the pre-bond test of 3D ICs},
author = {Yong-Xiao Chen and Yu-Jen Huang and Jin-Fu Li},
year = {2012},
doi = {10.1109/VTS.2012.6231087},
url = {http://dx.doi.org/10.1109/VTS.2012.6231087},
researchr = {https://researchr.org/publication/ChenHL12-1},
cites = {0},
citedby = {0},
pages = {102-107},
booktitle = {30th IEEE VLSI Test Symposium, VTS 2012, Maui, Hawaii, USA, 23-26 April 2012},
publisher = {IEEE},
isbn = {978-1-4673-1074-1},
}