Yibo Chen, Eren Kursun, Dave Motschman, Charles Johnson, Yuan Xie. Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs. In Vojin G. Oklobdzija, Barry Pangle, Naehyuck Chang, Naresh R. Shanbhag, Chris H. Kim, editors, Proceedings of the 2010 International Symposium on Low Power Electronics and Design, 2010, Austin, Texas, USA, August 18-20, 2010. pages 397-402, ACM, 2011. [doi]
Abstract is missing.