Po-Chih Chen, Demin Liu, Kuan-Neng Chen. Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{ChenLC19-16,
title = {Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C},
author = {Po-Chih Chen and Demin Liu and Kuan-Neng Chen},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058866},
url = {https://doi.org/10.1109/3DIC48104.2019.9058866},
researchr = {https://researchr.org/publication/ChenLC19-16},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}