Interconnect thermal modeling for accurate simulation of circuittiming and reliability - researchr publication authors

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Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang. Interconnect thermal modeling for accurate simulation of circuittiming and reliability. IEEE Trans. on CAD of Integrated Circuits and Systems, 19(2):197-205, 2000. [doi]

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