Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang. Interconnect thermal modeling for accurate simulation of circuittiming and reliability. IEEE Trans. on CAD of Integrated Circuits and Systems, 19(2):197-205, 2000. [doi]
@article{ChenLRK00,
title = {Interconnect thermal modeling for accurate simulation of circuittiming and reliability},
author = {Danqing Chen and Erhong Li and Elyse Rosenbaum and Sung-Mo Kang},
year = {2000},
doi = {10.1109/43.828548},
url = {http://doi.ieeecomputersociety.org/10.1109/43.828548},
tags = {modeling, reliability},
researchr = {https://researchr.org/publication/ChenLRK00},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {19},
number = {2},
pages = {197-205},
}