Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders

W.-M. Chen, Paul McCloskey, S. Cian O Mathuna. Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectronics Reliability, 46(5-6):896-904, 2006. [doi]

Authors

W.-M. Chen

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Paul McCloskey

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S. Cian O Mathuna

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