W.-M. Chen, Paul McCloskey, S. Cian O Mathuna. Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectronics Reliability, 46(5-6):896-904, 2006. [doi]
@article{ChenMO06,
title = {Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders},
author = {W.-M. Chen and Paul McCloskey and S. Cian O Mathuna},
year = {2006},
doi = {10.1016/j.microrel.2005.06.006},
url = {http://dx.doi.org/10.1016/j.microrel.2005.06.006},
researchr = {https://researchr.org/publication/ChenMO06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {5-6},
pages = {896-904},
}