Yukai Chen, Subrat Mishra, Julien Ryckaert, Dwaipayan Biswas, James Myers. Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology. In Design, Automation & Test in Europe Conference, DATE 2025, Lyon, France, March 31 - April 2, 2025. pages 1-2, IEEE, 2025. [doi]
Abstract is missing.