Ying-Jung Chen, Shanq-Jang Ruan. A cluster-based reliability- and thermal-aware 3D floorplanning using redundant STSVs. In 2015 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, South Korea, October 5-7, 2015. pages 349-354, IEEE, 2015. [doi]
@inproceedings{ChenR15-5,
title = {A cluster-based reliability- and thermal-aware 3D floorplanning using redundant STSVs},
author = {Ying-Jung Chen and Shanq-Jang Ruan},
year = {2015},
doi = {10.1109/VLSI-SoC.2015.7314442},
url = {http://dx.doi.org/10.1109/VLSI-SoC.2015.7314442},
researchr = {https://researchr.org/publication/ChenR15-5},
cites = {0},
citedby = {0},
pages = {349-354},
booktitle = {2015 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, South Korea, October 5-7, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9140-5},
}