A cluster-based reliability- and thermal-aware 3D floorplanning using redundant STSVs

Ying-Jung Chen, Shanq-Jang Ruan. A cluster-based reliability- and thermal-aware 3D floorplanning using redundant STSVs. In 2015 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, South Korea, October 5-7, 2015. pages 349-354, IEEE, 2015. [doi]

Abstract

Abstract is missing.