Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper

Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne. Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. In Mustafa Badaroglu, Shantanu Dutt, editors, Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, SLIP 2022, San Diego, California, 3 November 2022. ACM, 2022. [doi]

@inproceedings{ChenSZMWPB22,
  title = {Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper},
  author = {Rongmei Chen and Giuliano Sisto and Odysseas Zografos and Dragomir Milojevic and Pieter Weckx and Geert Van der Plas and Eric Beyne},
  year = {2022},
  doi = {10.1145/3557988.3569716},
  url = {https://doi.org/10.1145/3557988.3569716},
  researchr = {https://researchr.org/publication/ChenSZMWPB22},
  cites = {0},
  citedby = {0},
  booktitle = {Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, SLIP 2022, San Diego, California, 3 November 2022},
  editor = {Mustafa Badaroglu and Shantanu Dutt},
  publisher = {ACM},
  isbn = {978-1-4503-9536-6},
}