Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne. Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. In Mustafa Badaroglu, Shantanu Dutt, editors, Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, SLIP 2022, San Diego, California, 3 November 2022. ACM, 2022. [doi]
@inproceedings{ChenSZMWPB22, title = {Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper}, author = {Rongmei Chen and Giuliano Sisto and Odysseas Zografos and Dragomir Milojevic and Pieter Weckx and Geert Van der Plas and Eric Beyne}, year = {2022}, doi = {10.1145/3557988.3569716}, url = {https://doi.org/10.1145/3557988.3569716}, researchr = {https://researchr.org/publication/ChenSZMWPB22}, cites = {0}, citedby = {0}, booktitle = {Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, SLIP 2022, San Diego, California, 3 November 2022}, editor = {Mustafa Badaroglu and Shantanu Dutt}, publisher = {ACM}, isbn = {978-1-4503-9536-6}, }