Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne. Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. In Mustafa Badaroglu, Shantanu Dutt, editors, Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, SLIP 2022, San Diego, California, 3 November 2022. ACM, 2022. [doi]
Abstract is missing.