Meng-Ling Chen, Tu-Hsiung Tsai, Hung-Ming Chen, Shi-Hao Chen. Routability-driven bump assignment for chip-package co-design. In 19th Asia and South Pacific Design Automation Conference, ASP-DAC 2014, Singapore, January 20-23, 2014. pages 519-524, IEEE, 2014. [doi]
@inproceedings{ChenTCC14,
title = {Routability-driven bump assignment for chip-package co-design},
author = {Meng-Ling Chen and Tu-Hsiung Tsai and Hung-Ming Chen and Shi-Hao Chen},
year = {2014},
doi = {10.1109/ASPDAC.2014.6742944},
url = {http://dx.doi.org/10.1109/ASPDAC.2014.6742944},
researchr = {https://researchr.org/publication/ChenTCC14},
cites = {0},
citedby = {0},
pages = {519-524},
booktitle = {19th Asia and South Pacific Design Automation Conference, ASP-DAC 2014, Singapore, January 20-23, 2014},
publisher = {IEEE},
}