Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev. Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. on CAD of Integrated Circuits and Systems, 35(11):1811-1824, 2016. [doi]
Abstract is missing.