Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao. A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. on CAD of Integrated Circuits and Systems, 40(2):350-363, 2021. [doi]
Abstract is missing.