On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding - researchr publication authors

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Po-Yuan Chen, Cheng-Wen Wu, Ding-Ming Kwai. On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding. In 28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA. pages 263-268, IEEE Computer Society, 2010. [doi]

This author has not been identified. Look up 'Po-Yuan Chen' in GoogleThis author has not been identified. Look up 'Cheng-Wen Wu' in GoogleThis author has not been identified. Look up 'Ding-Ming Kwai' in Google

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