Po-Yuan Chen, Cheng-Wen Wu, Ding-Ming Kwai. On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding. In 28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA. pages 263-268, IEEE Computer Society, 2010. [doi]
@inproceedings{ChenWK10-0,
title = {On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding},
author = {Po-Yuan Chen and Cheng-Wen Wu and Ding-Ming Kwai},
year = {2010},
doi = {10.1109/VTS.2010.5469559},
url = {http://dx.doi.org/10.1109/VTS.2010.5469559},
tags = {testing, source-to-source, open-source},
researchr = {https://researchr.org/publication/ChenWK10-0},
cites = {0},
citedby = {0},
pages = {263-268},
booktitle = {28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA},
publisher = {IEEE Computer Society},
isbn = {978-1-4244-6648-1},
}