Po-Yuan Chen, Cheng-Wen Wu, Ding-Ming Kwai. On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding. In 28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA. pages 263-268, IEEE Computer Society, 2010. [doi]
Abstract is missing.