The following publications are possibly variants of this publication:
- Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICsMelamed, Samson, Thorolfsson, Thorlindur, Adi Srinivasan, Cheng, Edmund, Franzon, Paul, Davis, W. Rhett. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-6, 2010.