Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability - researchr publication authors

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Lerong Cheng, Puneet Gupta, Costas J. Spanos, Kun Qian, Lei He. Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability. In Proceedings of the 46th Design Automation Conference, DAC 2009, San Francisco, CA, USA, July 26-31, 2009. pages 104-109, ACM, 2009. [doi]

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