Lerong Cheng, Puneet Gupta, Costas J. Spanos, Kun Qian, Lei He. Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability. In Proceedings of the 46th Design Automation Conference, DAC 2009, San Francisco, CA, USA, July 26-31, 2009. pages 104-109, ACM, 2009. [doi]
@inproceedings{ChengGSQH09,
title = {Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability},
author = {Lerong Cheng and Puneet Gupta and Costas J. Spanos and Kun Qian and Lei He},
year = {2009},
doi = {10.1145/1629911.1629945},
url = {http://doi.acm.org/10.1145/1629911.1629945},
tags = {modeling, systematic-approach},
researchr = {https://researchr.org/publication/ChengGSQH09},
cites = {0},
citedby = {0},
pages = {104-109},
booktitle = {Proceedings of the 46th Design Automation Conference, DAC 2009, San Francisco, CA, USA, July 26-31, 2009},
publisher = {ACM},
isbn = {978-1-60558-497-3},
}