Physically Justifiable Die-Level Modeling of Spatial Variation in View of Systematic Across Wafer Variability - researchr publication

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Lerong Cheng, Puneet Gupta, Costas J. Spanos, Kun Qian, Lei He. Physically Justifiable Die-Level Modeling of Spatial Variation in View of Systematic Across Wafer Variability. IEEE Trans. on CAD of Integrated Circuits and Systems, 30(3):388-401, 2011. [doi]

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