Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen. Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.