A novel method to mitigate TSV electromigration for 3D ICs - researchr publication authors

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Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dillio, Patrick Girard, Arnaud Virazel, Pascal Vevet, Marc Belleville. A novel method to mitigate TSV electromigration for 3D ICs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2013, Natal, Brazil, August 5-7, 2013. pages 121-126, IEEE, 2013. [doi]

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