Yuanqing Cheng, Aida Todri-Sanial, Alberto Bosio, Luigi Dillio, Patrick Girard, Arnaud Virazel, Pascal Vevet, Marc Belleville. A novel method to mitigate TSV electromigration for 3D ICs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2013, Natal, Brazil, August 5-7, 2013. pages 121-126, IEEE, 2013. [doi]
@inproceedings{ChengTBDGVVB13,
title = {A novel method to mitigate TSV electromigration for 3D ICs},
author = {Yuanqing Cheng and Aida Todri-Sanial and Alberto Bosio and Luigi Dillio and Patrick Girard and Arnaud Virazel and Pascal Vevet and Marc Belleville},
year = {2013},
doi = {10.1109/ISVLSI.2013.6654633},
url = {http://dx.doi.org/10.1109/ISVLSI.2013.6654633},
researchr = {https://researchr.org/publication/ChengTBDGVVB13},
cites = {0},
citedby = {0},
pages = {121-126},
booktitle = {IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2013, Natal, Brazil, August 5-7, 2013},
publisher = {IEEE},
}