On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

Chun-Chuan Chi, Bing-Yang Lin, Cheng-Wen Wu, Min-Jer Wang, Hung-Chih Lin, Ching-Nen Peng. On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs. IEEE Design & Test of Computers, 31(4):16-26, 2014. [doi]

Authors

Chun-Chuan Chi

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Bing-Yang Lin

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Cheng-Wen Wu

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Min-Jer Wang

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Hung-Chih Lin

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Ching-Nen Peng

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