On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs - researchr publication authors

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Chun-Chuan Chi, Bing-Yang Lin, Cheng-Wen Wu, Min-Jer Wang, Hung-Chih Lin, Ching-Nen Peng. On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs. IEEE Design & Test of Computers, 31(4):16-26, 2014. [doi]

This author has not been identified. Look up 'Chun-Chuan Chi' in GoogleThis author has not been identified. Look up 'Bing-Yang Lin' in GoogleThis author has not been identified. Look up 'Cheng-Wen Wu' in GoogleThis author has not been identified. Look up 'Min-Jer Wang' in GoogleThis author has not been identified. Look up 'Hung-Chih Lin' in GoogleThis author has not been identified. Look up 'Ching-Nen Peng' in Google

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