Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu. Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base. In Bill Eklow, R. D. (Shawn) Blanton, editors, 2011 IEEE International Test Conference, ITC 2011, Anaheim, CA, USA, September 20-22, 2011. pages 1-10, IEEE, 2011. [doi]
@inproceedings{ChiMGW11-1,
title = {Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base},
author = {Chun-Chuan Chi and Erik Jan Marinissen and Sandeep Kumar Goel and Cheng-Wen Wu},
year = {2011},
doi = {10.1109/TEST.2011.6139181},
url = {http://dx.doi.org/10.1109/TEST.2011.6139181},
researchr = {https://researchr.org/publication/ChiMGW11-1},
cites = {0},
citedby = {0},
pages = {1-10},
booktitle = {2011 IEEE International Test Conference, ITC 2011, Anaheim, CA, USA, September 20-22, 2011},
editor = {Bill Eklow and R. D. (Shawn) Blanton},
publisher = {IEEE},
isbn = {978-1-4577-0153-5},
}