Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu. Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base. IEEE Trans. VLSI Syst., 22(11):2388-2401, 2014. [doi]

Abstract

Abstract is missing.