3D-IC interconnect test, diagnosis, and repair

Chun-Chuan Chi, Cheng-Wen Wu, Min-Jer Wang, Hung-Chih Lin. 3D-IC interconnect test, diagnosis, and repair. In 31st IEEE VLSI Test Symposium, VTS 2013, Berkeley, CA, USA, April 29 - May 2, 2013. pages 1-6, IEEE Computer Society, 2013. [doi]

Abstract

Abstract is missing.