Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects

TingYen Chiang, Kaustav Banerjee, Krishna Saraswat. Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects. In ICCAD. pages 165, 2001. [doi]

Authors

TingYen Chiang

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Kaustav Banerjee

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Krishna Saraswat

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