Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects

TingYen Chiang, Kaustav Banerjee, Krishna Saraswat. Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects. In ICCAD. pages 165, 2001. [doi]

Abstract

Abstract is missing.