TingYen Chiang, Kaustav Banerjee, Krishna Saraswat. Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects. In ICCAD. pages 165, 2001. [doi]
@inproceedings{ChiangBS01,
title = {Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects},
author = {TingYen Chiang and Kaustav Banerjee and Krishna Saraswat},
year = {2001},
url = {http://www.sigda.org/Archives/ProceedingArchives/Iccad/Iccad2001/papers/2001/iccad01/htmfiles/sun_sgi/iccadabs.htm#03d_3},
tags = {rule-based, modeling, analysis},
researchr = {https://researchr.org/publication/ChiangBS01},
cites = {0},
citedby = {0},
pages = {165},
booktitle = {ICCAD},
}