Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin. Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework. IJMTM, 14(1/2):130-144, 2008. [doi]
@article{ChienHL08,
title = {Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework},
author = {Chen-Fu Chien and Chih-Han Hu and Chi-Yung Lin},
year = {2008},
doi = {10.1504/IJMTM.2008.017491},
url = {http://dx.doi.org/10.1504/IJMTM.2008.017491},
tags = {empirical},
researchr = {https://researchr.org/publication/ChienHL08},
cites = {0},
citedby = {0},
journal = {IJMTM},
volume = {14},
number = {1/2},
pages = {130-144},
}