Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework

Chen-Fu Chien, Chih-Han Hu, Chi-Yung Lin. Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework. IJMTM, 14(1/2):130-144, 2008. [doi]

Abstract

Abstract is missing.