Jui-Hung Chien, Ruei-Siang Hsu, Hsueh-Ju Lin, Ka-Yi Yeh, Shih-Chieh Chang. Contactless Stacked-die Testing for Pre-bond Interposers. In The 51st Annual Design Automation Conference 2014, DAC '14, San Francisco, CA, USA, June 1-5, 2014. pages 1-6, ACM, 2014. [doi]
Abstract is missing.