Hong-Wen Chiou, Jia-Hao Jiang, Yu-Teng Chang, Yu-Min Lee, Chi-Wen Pan. Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. In Atsushi Takahashi 0001, editor, Proceedings of the 28th Asia and South Pacific Design Automation Conference, ASPDAC 2023, Tokyo, Japan, January 16-19, 2023. pages 7-12, ACM, 2023. [doi]
Abstract is missing.