Signal integrity design of TSV and interposer in 3D-IC

Jonghyun Cho, Joungho Kim. Signal integrity design of TSV and interposer in 3D-IC. In 4th IEEE Latin American Symposium on Circuits and Systems, LASCAS 2013, Cusco, Peru, February 27 - March 1, 2013. pages 1-4, IEEE, 2013. [doi]

Authors

Jonghyun Cho

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Joungho Kim

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