Jonghyun Cho, Joungho Kim. Signal integrity design of TSV and interposer in 3D-IC. In 4th IEEE Latin American Symposium on Circuits and Systems, LASCAS 2013, Cusco, Peru, February 27 - March 1, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{ChoK13-11,
title = {Signal integrity design of TSV and interposer in 3D-IC},
author = {Jonghyun Cho and Joungho Kim},
year = {2013},
doi = {10.1109/LASCAS.2013.6519092},
url = {https://doi.org/10.1109/LASCAS.2013.6519092},
researchr = {https://researchr.org/publication/ChoK13-11},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {4th IEEE Latin American Symposium on Circuits and Systems, LASCAS 2013, Cusco, Peru, February 27 - March 1, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4897-3},
}