33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction

Jeonghoon Cho, You Jang Pyeon, Junyeong Yeom, Hyunjoong Kim, Sanghyeon Cho, Yonggi Kim, Taejung Kim, Jong-Hyun Kwak, Geonjun Choi, Yoonsik Lee, Heungjoo Shin, Hoon Eui Jeong, Jae-Joon Kim. 33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction. In IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024. pages 554-556, IEEE, 2024. [doi]

Authors

Jeonghoon Cho

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You Jang Pyeon

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Junyeong Yeom

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Hyunjoong Kim

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Sanghyeon Cho

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Yonggi Kim

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Taejung Kim

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Jong-Hyun Kwak

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Geonjun Choi

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Yoonsik Lee

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Heungjoo Shin

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Hoon Eui Jeong

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Jae-Joon Kim

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