Jeonghoon Cho, You Jang Pyeon, Junyeong Yeom, Hyunjoong Kim, Sanghyeon Cho, Yonggi Kim, Taejung Kim, Jong-Hyun Kwak, Geonjun Choi, Yoonsik Lee, Heungjoo Shin, Hoon Eui Jeong, Jae-Joon Kim. 33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction. In IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024. pages 554-556, IEEE, 2024. [doi]
@inproceedings{ChoPYKCKKKCLSJK24,
title = {33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction},
author = {Jeonghoon Cho and You Jang Pyeon and Junyeong Yeom and Hyunjoong Kim and Sanghyeon Cho and Yonggi Kim and Taejung Kim and Jong-Hyun Kwak and Geonjun Choi and Yoonsik Lee and Heungjoo Shin and Hoon Eui Jeong and Jae-Joon Kim},
year = {2024},
doi = {10.1109/ISSCC49657.2024.10454293},
url = {https://doi.org/10.1109/ISSCC49657.2024.10454293},
researchr = {https://researchr.org/publication/ChoPYKCKKKCLSJK24},
cites = {0},
citedby = {0},
pages = {554-556},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024},
publisher = {IEEE},
isbn = {979-8-3503-0620-0},
}