Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration - researchr publication authors

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Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim. Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-3, IEEE, 2019. [doi]

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