Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim. Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-3, IEEE, 2019. [doi]
@inproceedings{ChoiEMJLKK19,
title = {Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration},
author = {Kwang-Seong Choi and Yong-Sung Eom and Seok Hwan Moon and Jiho Joo and Kwangjoo Lee and Jung Hak Kim and Ju Hyeon Kim},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058890},
url = {https://doi.org/10.1109/3DIC48104.2019.9058890},
researchr = {https://researchr.org/publication/ChoiEMJLKK19},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}