Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias

Yung-Fa Chou, Ding-Ming Kwai, Cheng-Wen Wu. Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias. IEEE Trans. VLSI Syst., 19(8):1346-1356, 2011. [doi]

Authors

Yung-Fa Chou

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Ding-Ming Kwai

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Cheng-Wen Wu

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