Yung-Fa Chou, Ding-Ming Kwai, Cheng-Wen Wu. Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias. IEEE Trans. VLSI Syst., 19(8):1346-1356, 2011. [doi]
@article{ChouKW11,
title = {Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias},
author = {Yung-Fa Chou and Ding-Ming Kwai and Cheng-Wen Wu},
year = {2011},
doi = {10.1109/TVLSI.2010.2051466},
url = {http://dx.doi.org/10.1109/TVLSI.2010.2051466},
researchr = {https://researchr.org/publication/ChouKW11},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {19},
number = {8},
pages = {1346-1356},
}