Cu-based alloys for 3DP by melt extrusion process

C. S. Chou, W. C. J. Wei, B. H. Liu, A. B. Wang, R. C. Luo. Cu-based alloys for 3DP by melt extrusion process. In IEEE International Conference on Industrial Technology, ICIT 2016, Taipei, Taiwan, March 14-17, 2016. pages 1152-1157, IEEE, 2016. [doi]

Authors

C. S. Chou

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W. C. J. Wei

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B. H. Liu

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A. B. Wang

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R. C. Luo

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